陶熙 TC-5021

Gray, flowable, non-curing thermally conductive compound

Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides.

This combination promotes high thermal conductivity, low bleed and high-temperature stability.

The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies to the heat sink or chassis, thereby increasing the overall efficiency of the device.

Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).