泰吉诺 Fill-LM SW8000
描述信息
Tegino liquid metal Fill-LM.SW8000 is a
The high indium-base alloy heat guide sheet can be treated by three Ming.
BiInSn/In/BiInSn's sandwich-like structure makes it in
When operating at a certain temperature, low melting point alloys (BiInSn) can
A low melting point alloy layer, liquid, is formed on the upper and lower surfaces of the indium sheet
After melting, the interface thermal resistance can be effectively eliminated.
The Fill-LM.SW8000 has an extremely high thermal conductivity
And very low thermal resistance, while having a good liquid metal
Reliability and scalability. The product has stable physical and chemical properties.
It can still work normally in high temperature environment for a long time and is heat resistant
The properties are much higher than existing thermal interface materials.
The Fill-LM.SW8000 is designed for high heat flux power
Device based design. Simple operation of solid sheet is easier than application
It can be used directly as a gasket to meet different requirements
Use environmental requirements.
产品应用
- ◆ CPU, GPU processor and other chipsets
- ◆ LED, laser and other optical devices
- ◆ Server, liquid cooled data center heat dissipation
- ◆ Automotive Electronics
- ◆ Test sorting
- ◆ IGBT modules, etc
技术性能
关联智库3人
