泰吉诺 Fill-LM SW8000

Tegino liquid metal Fill-LM.SW8000 is a

The high indium-base alloy heat guide sheet can be treated by three Ming.

BiInSn/In/BiInSn's sandwich-like structure makes it in

When operating at a certain temperature, low melting point alloys (BiInSn) can

A low melting point alloy layer, liquid, is formed on the upper and lower surfaces of the indium sheet

After melting, the interface thermal resistance can be effectively eliminated.

The Fill-LM.SW8000 has an extremely high thermal conductivity

And very low thermal resistance, while having a good liquid metal

Reliability and scalability. The product has stable physical and chemical properties.

It can still work normally in high temperature environment for a long time and is heat resistant

The properties are much higher than existing thermal interface materials.

The Fill-LM.SW8000 is designed for high heat flux power

Device based design. Simple operation of solid sheet is easier than application

It can be used directly as a gasket to meet different requirements

Use environmental requirements.