汉高 3562 Underfill for flip chip devices
描述信息
热固化环氧树脂
乐泰3562®产品是一种高纯度环氧树脂,设计用于为倒装芯片设备作为填充不足这种产品可以在高温下治疗产品3562是为了改善硅晶片钝化表面的附着力而制定的它的高抗弯强度和良好的防潮性能，在热循环过程中提供了更强的焊点保护
产品应用
- Flip Chip/Underfill applications. Product 3562 is suitable for bare chip protection in a variety of advanced packages such as IC memory cards, chip carriers, hybrid circuits, chip-on board, multi-chip modules, ball grid arrays and pin grid arrays. Use of Product 3562 requires at least a 3 mil gap between die and substrate.
技术性能
存储条件/有效期Storage/Shelf life
-40°C
密度/比重Density/specific gravity
1.74 numeric
颜色Color
Blue-black
产品形态Product form
液态Liquid
固化方式Cure Method
Heat
玻璃化转变温度Glass transition temperature
150 ℃
材料体系chemical system
Epoxy base
表面电阻Surface Resistance
3.7E+15 Ω
体积电阻/率Volume Resistivity/Resistance
8.1E+15 ohm·cm
化学类型Chemical type
epoxy
填料/填料含量Filler/content
70 %
粒径particle size
60 µm
类型type
线性
热膨胀系数Coefficient of thermal expansion
2.5E-05 m/m/℃ m/m/℃
Tg标准Tg level
小于Tg
粘度viscosity
49000 cps cps
转速speed
10 rpm rpm
转子spindle#
6
测试温度test temperature
25 ℃ ℃
温度temperature
165 ℃ ℃
固化时间cure time
1 hr hr
时间类型Type
Pot Life
温度temperature
25 ℃ ℃
胶粘剂操作时间Adhesive work life
3 day day
重量weight
200 g g
弯折度数Angle
180 ° °
测试温度temperature
25 ℃ ℃
挠曲强度flexural strength
17800 lbf/in^2(PSI) lbf/in^2(PSI)
介电常数Dielectric Constant
4.03 numeric numeric
损耗因子Dissipation Factor
0.008 numeric numeric
频率Frequency
1 KHz KHz
温度temperature
25 ℃ ℃
时间类型Type
Gel Time
时间time
10 min min
温度temperature
121 ℃ ℃
类型Type
线收缩
收缩率Shrinkage
1.57 % %