德路 DA587
描述信息
http://pdf.bondme.com//files/product/2017/07/06/ef/URxPG.pdf
产品应用
- - for the bonding of bare semiconductors (ICs) to epoxy tapes for smart card technology, metal lead frames, rigid and flexible printed circuit boards
- - the adhesive is ideal for the use in connection with the UV-curing chip encapsulation compounds DELO-KATIOBOND
- of course, it can also be combined with other chip encapsulation compounds
- - due to fast curing at low temperatures, the product is especially suitable for the use on temperature-sensitive substrates, e. g., in smart card technology
技术性能
密度/比重Density/specific gravity
1.45 g/cm^3
产品形态Product form
液态Liquid
玻璃化转变温度Glass transition temperature
78 ℃
颜色Color
white
固化方式Cure Method
Heat
ROHS认证ROHS compliant
YES
材料体系chemical system
Epoxy base
邵氏硬度Shore Hardness
78 D
化学类型Chemical type
modified epoxy resin
降解温度degration temperature
284 ℃
触变指数Thixotropic Index
3
粘度viscosity
70000 mPa·s mPa·s
转速speed
2 r/sec r/sec
测试温度test temperature
23 ℃ ℃
类型type
线性
热膨胀率thermal expansion ratio
94 ppm/K ppm/K
Tg标准Tg level
小于Tg
温度temperature
25 ℃ ℃
固化时间cure time
5 day day
存储条件Storage
in unopened original container, <=-18°C
有效期Shelf life
6 Month Month
条件Conduction
长期低温
工作温度Operating/Working Temperature
-40 ℃ ℃
强度类型Strength Item
弹性/杨氏模量值(E)
强度值/模量值Strength Value
1400 MPa MPa
类型Type
体积收缩
收缩率Shrinkage
3.8 % %
吸水率Water Absorption
0.5 % %
测试条件test conditon
24 h at room temperatur e (approx. 23 °C)
基材Substrate
glass&epoxy tape
测试温度temperature
23 ℃ ℃
晶片剪切die shear
57.5 N/mm^2 N/mm^2
——改性环氧树脂
-单组分，热固化，无溶剂，触变
——颜色白色