德路 GE7985
描述信息
http://pdf.bondme.com//files/product/2017/07/06/da/kpSAV.pdf
产品应用
- - especially for the casting of bare semiconductors and sensors
- - the cured product is normally used in a temperature range of -65 °C to +200 °C
- depending on the application, other limits may be more reasonable
- - compliant with RoHS directive 2015/863/EU
技术性能
密度/比重Density/specific gravity
1.8 g/cm^3
产品形态Product form
液态Liquid
玻璃化转变温度Glass transition temperature
162 ℃
颜色Color
black
固化方式Cure Method
Heat
ROHS认证ROHS compliant
YES
材料体系chemical system
Epoxy base
化学类型Chemical type
epoxy
吸水率Water Absorption
0.2 %
降解温度degration temperature
295 ℃
填料/填料含量Filler/content
<16 µm
体积电阻/率Volume Resistivity/Resistance
e+17 ohm·cm
表面电阻Surface Resistance
100000000000000 Ω
玻璃化转变温度Glass transition temperature
180
粘度viscosity
160000 mPa·s mPa·s
转速speed
10 r/sec r/sec
测试温度test temperature
23 ℃ ℃
类型type
线性
热膨胀率thermal expansion ratio
24 ppm/K ppm/K
温度temperature
150 ℃ ℃
固化时间cure time
20 min min
有效期Shelf life
6 Month Month
存储条件Storage
in unopened original container, -18°C
条件Conduction
长期低温
工作温度Operating/Working Temperature
-65 ℃ ℃
强度类型Strength Item
弹性/杨氏模量值(E)
强度值/模量值Strength Value
10700 MPa MPa
基材substrate
FR4
压缩剪切强度compressive shear strength
20 Mpa Mpa
收缩率Shrinkage
1 % %
类型Type
体积收缩
——环氧树脂
-单组分，热固化，无溶剂，填充，触变