德路 GE765
描述信息
http://pdf.bondme.com//files/product/2017/07/06/ce/WjcXP.pdf
产品应用
- - especially for the casting of bare semiconductors and sensors
- - the cured product is normally used in a temperature range of -65 °C to +180 °C
- depending on the application, other limits may be more reasonable
- - meets the requirements of JEDEC MSL1
- - compliant with RoHS directive 2015/863/EU
- - successfully tested according to UL 94 HB (by an independent test institute)
技术性能
密度/比重Density/specific gravity
1.7 g/cm^3
产品形态Product form
液态Liquid
玻璃化转变温度Glass transition temperature
186 ℃
颜色Color
black
固化方式Cure Method
Heat
ROHS认证ROHS compliant
YES
材料体系chemical system
Epoxy base
邵氏硬度Shore Hardness
86 D
化学类型Chemical type
epoxy
吸水率Water Absorption
0.13 %
粘度viscosity
22000 mPa·s mPa·s
转速speed
10 r/sec r/sec
测试温度test temperature
23 ℃ ℃
类型type
线性
热膨胀率thermal expansion ratio
18 ppm/K ppm/K
温度temperature
25 ℃ ℃
固化时间cure time
48 hr hr
存储条件Storage
in unopened original container, -18°C
有效期Shelf life
6 Month Month
条件Conduction
长期低温
工作温度Operating/Working Temperature
-65 ℃ ℃
强度类型Strength Item
弹性/杨氏模量值(E)
强度值/模量值Strength Value
9000 MPa MPa
基材substrate
Al
压缩剪切强度compressive shear strength
20 Mpa Mpa
——环氧浇铸树脂
-单组分，热固化，无溶剂，填充，触变