德路 6093
描述信息
http://pdf.bondme.com//files/product/2017/07/06/ba/sXGjV.pdf
产品应用
- for the casting, coating and fixing of components and assembly groups
- especially for the use in electronics
- good flow behavior
- the cured product is normally used in a temperature range of -40 °C to +150 °C
- depending on the application, other limits may be more reasonable
- compliant with RoHS directive 2015/863/EU
技术性能
密度/比重Density/specific gravity
1.2 g/cm^3
产品形态Product form
膏状Paste Gel
玻璃化转变温度Glass transition temperature
93 ℃
颜色Color
black
固化方式Cure Method
Heat
ROHS认证ROHS compliant
YES
材料体系chemical system
Epoxy base
邵氏硬度Shore Hardness
74 D
化学类型Chemical type
Epoxy
压痕硬度Ball indentation hardness
137 Mpa
吸水率Water Absorption
0.1 %
表面电阻Surface Resistance
>1e+12 Ω
介电常数/损耗因子Dielectric Constant/Dissipation Factor
3.9 numeric
绝缘强度/介电强度Dielectric Strength
18 kV/mm
体积电阻/率Volume Resistivity/Resistance
>1e+13 ohm·cm
降解 温度degration temperature
300 ℃
粘度viscosity
40000 mPa·s mPa·s
转速speed
1.4 rpm rpm
测试温度test temperature
23 ℃ ℃
剪切力Shear
14 Mpa Mpa
基材Substrate
Al
胶层厚度Bonding line thickness
1.6 mm mm
表面状态Surface condition
sand-blasted
类型type
线性
热膨胀率thermal expansion ratio
111 ppm/K ppm/K
温度temperature
25 ℃ ℃
固化时间cure time
42 day day
有效期Shelf life
6 Month Month
存储条件Storage
in unopened original container, 0 °C to +10 °C
强度类型Strength Item
拉伸强度
强度值/模量值Strength Value
41 MPa MPa
收缩率Shrinkage
1.1 % %
类型Type
体积收缩
基材substrate
PETP
压缩剪切强度compressive shear strength
20 Mpa Mpa
条件Conduction
长期低温
工作温度Operating/Working Temperature
-40 ℃ ℃