德路 HT760
描述信息
http://pdf.bondme.com//files/product/2017/07/06/ae/pxXnE.pdf
产品应用
- especially for the bonding or casting of bare semiconductors and sensors
- the cured product can be used in a temperature range of -65 °C to +250 °C
- depending on the application, other limits may be more reasonable
- compliant with RoHS directive 2015/863/EU
技术性能
密度/比重Density/specific gravity
1.7 g/cm^3
产品形态Product form
液态Liquid
玻璃化转变温度Glass transition temperature
162 ℃
颜色Color
black
固化方式Cure Method
Heat
ROHS认证ROHS compliant
YES
材料体系chemical system
Epoxy base
化学类型Chemical type
epoxy
玻璃化转变温度Glass transition temperature
145 ℃
降解温度degration temperature
308 ℃
粘度viscosity
35000 mPa·s mPa·s
转速speed
10 r/sec r/sec
测试温度test temperature
23 ℃ ℃
类型type
线性
热膨胀率thermal expansion ratio
25 ppm/K ppm/K
Tg标准Tg level
小于Tg
温度temperature
150 ℃ ℃
固化时间cure time
20 min min
有效期Shelf life
1 Day Day
存储条件Storage
Storage life at 25°C in unopened original container
条件Conduction
长期低温
工作温度Operating/Working Temperature
-65 ℃ ℃
强度类型Strength Item
弹性/杨氏模量值(E)
强度值/模量值Strength Value
8700 MPa MPa
吸水率Water Absorption
0.1 % %
测试条件test conditon
after cured 20min at +150°C
基材substrate
FR4
压缩剪切强度compressive shear strength
67 Mpa Mpa
环氧树脂
单组分，热固化，无溶剂，填充，触变