德路 GE725

德路填充,热固化电子铸造化合物热固化环氧胶附件 ↗

描述信息

德路

http://pdf.bondme.com//files/product/2017/07/06/bd/sREIN.pdf

产品应用

  • - especially for the casting of bare semiconductors and sensors
  • - the cured product is normally used in a temperature range of -65 °C to +180 °C
  • depending on the application, other limits may be more reasonable
  • - meets the requirements of JEDEC MSL1
  • - compliant with RoHS directive 2015/863/EU
  • - successfully tested according to UL 94 HB (by an independent test institute)

技术性能

密度/比重Density/specific gravity
1.67 g/cm^3
产品形态Product form
液态Liquid
玻璃化转变温度Glass transition temperature
178 ℃
颜色Color
black
固化方式Cure Method
Heat
ROHS认证ROHS compliant
YES
材料体系chemical system
Epoxy base
邵氏硬度Shore Hardness
87 D
化学类型Chemical type
epoxy
吸水率Water Absorption
0.1 %
降解温度degration temperature
323 ℃
粘度viscosity
6500 mPa·s mPa·s
转速speed
10 r/sec r/sec
测试温度test temperature
23 ℃ ℃
类型type
线性
热膨胀率thermal expansion ratio
25 ppm/K ppm/K
温度temperature
25 ℃ ℃
固化时间cure time
48 hr hr
有效期Shelf life
6 Month Month
存储条件Storage
in unopened original container, -18°C
条件Conduction
长期低温
工作温度Operating/Working Temperature
-65 ℃ ℃
强度类型Strength Item
弹性/杨氏模量值(E)
强度值/模量值Strength Value
9700 MPa MPa
介电常数Dielectric Constant
3.7 numeric numeric
频率Frequency
1 MHz MHz
温度temperature
25 ℃ ℃
基材substrate
Al
压缩剪切强度compressive shear strength
22 Mpa Mpa
导热率Thermal Conductivity
0.5 W/(m·K) W/(m·K)
胶层厚度adhesive thickness
0.5 mm mm
——环氧浇铸树脂
-单组分,热固化,无溶剂,填充,触变